TY  - RPRT
TI  - MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC
AU  - Tianxiang Zhu
AU  - Qipan Wang
AU  - Yibo Lin
AU  - Runsheng Wang
AU  - Ru Huang
PY  - 2024
UR  - https://arxiv.org/abs/2411.12690
ID  - 2411.12690
ER  -