@misc{indiciae99f98d95adf3,
  title = {Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging},
  author = {Partho Bhoumik and Christopher Bailey and Krishnendu Chakrabarty},
  year = {2025},
  url = {https://arxiv.org/abs/2503.14784},
  note = {Source identifier: 2503.14784}
}