TY  - RPRT
TI  - Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging
AU  - Partho Bhoumik
AU  - Christopher Bailey
AU  - Krishnendu Chakrabarty
PY  - 2025
UR  - https://arxiv.org/abs/2503.14784
ID  - 2503.14784
ER  -