TY  - RPRT
TI  - STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration
AU  - Varun Darshana Parekh
AU  - Zachary Wyatt Hazenstab
AU  - Srivatsa Rangachar Srinivasa
AU  - Krishnendu Chakrabarty
AU  - Kai Ni
AU  - Vijaykrishnan Narayanan
PY  - 2025
DO  - 10.1109/iccd65941.2025.00029
UR  - https://arxiv.org/abs/2504.21140
ID  - 2504.21140
ER  -