@misc{indiciaec7dccacb40f4,
  title = {3D-Integrated Superconducting qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures},
  author = {T. Mayer and H. Bender and S. J. K. Lang and Z. Luo and J. Weber and C. Moran Guizan and C. Dhieb and D. Zahn and L. Schwarzenbach and W. Hell and M. Andronic and A. Drost and K. Neumeier and W. Lerch and L. Nebrich and A. Hagelauer and I. Eisele and R. N. Pereira and C. Kutter},
  year = {2025},
  url = {https://arxiv.org/abs/2505.04337},
  note = {Source identifier: 2505.04337}
}