@misc{indiciaea8ffa5ec9aed,
  title = {Qualification of Bump Bonding in CMS Inner Tracker Pixel Modules for the Phase-2 Upgrade},
  author = {Panagiotis Assiouras},
  year = {2025},
  url = {https://arxiv.org/abs/2505.06752},
  note = {Source identifier: 2505.06752}
}