@misc{indiciae57dc547b04fc,
  title = {Designing High-Performance and Thermally Feasible Multi-Chiplet Architectures enabled by Non-bendable Glass Interposer},
  author = {Harsh Sharma and Janardhan Rao Doppa and Umit Y. Ogras and Partha Pratim Pande},
  year = {2025},
  url = {https://arxiv.org/abs/2507.18040},
  note = {Source identifier: 2507.18040}
}