TY  - RPRT
TI  - Designing High-Performance and Thermally Feasible Multi-Chiplet Architectures enabled by Non-bendable Glass Interposer
AU  - Harsh Sharma
AU  - Janardhan Rao Doppa
AU  - Umit Y. Ogras
AU  - Partha Pratim Pande
PY  - 2025
UR  - https://arxiv.org/abs/2507.18040
ID  - 2507.18040
ER  -