@misc{indiciaeaec22e30bfd3,
  title = {ProForm: Solder-Free Circuit Assembly Using Thermoforming},
  author = {Narjes Pourjafarian and Zhenming Yang and Jeffrey I. Lipton and Benyamin Davaji and Gregory D. Abowd},
  year = {2025},
  doi = {10.1145/3746059.3747628},
  url = {https://arxiv.org/abs/2507.20933},
  note = {Source identifier: 2507.20933}
}