@misc{indiciae6be2d61554ac,
  title = {Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology},
  author = {Yukai Chen and Massimiliano Di Todaro and Bjorn Vermeersch and Herman Oprins and Daniele Jahier Pagliari and Julien Ryckaert and Dwaipayan Biswas and James Myers},
  year = {2025},
  url = {https://arxiv.org/abs/2508.02284},
  note = {Source identifier: 2508.02284}
}