TY  - RPRT
TI  - Virtual Sensing for Solder Layer Degradation and Temperature Monitoring in IGBT Modules
AU  - Andrea Urgolo
AU  - Monika Stipsitz
AU  - Hèlios Sanchis-Alepuz
PY  - 2026
DO  - 10.1109/icsrs68021.2025.11422051
UR  - https://arxiv.org/abs/2508.10515
ID  - 2508.10515
ER  -