@misc{indiciae285cf15a048b,
  title = {Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features},
  author = {Yanpeng Gong and Sishuai Li and Fei Qin and Bingbing Xu},
  year = {2025},
  doi = {10.1007/s00366-025-02219-8},
  url = {https://arxiv.org/abs/2508.11410},
  note = {Source identifier: 2508.11410}
}