TY  - RPRT
TI  - Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features
AU  - Yanpeng Gong
AU  - Sishuai Li
AU  - Fei Qin
AU  - Bingbing Xu
PY  - 2025
DO  - 10.1007/s00366-025-02219-8
UR  - https://arxiv.org/abs/2508.11410
ID  - 2508.11410
ER  -