@misc{indiciae099b8af8ba77,
  title = {Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits},
  author = {Yibo Chen and Eren Kurshan and Dave Motschman and Charles Johnson and Yuan Xie},
  year = {2025},
  url = {https://arxiv.org/abs/2508.13160},
  note = {Source identifier: 2508.13160}
}