@misc{indiciae74fafbf36e40,
  title = {Characterization of heat transfer in 3D CMOS structures using Sideband Scanning Thermal Wave Microscopy},
  author = {Valentin Fonck and Mohammadali Razeghi and Jean Spièce and Phillip Dobson and Jonathan Weaver and George Ridgard and Grayson M. Noah and Pascal Gehring},
  year = {2025},
  url = {https://arxiv.org/abs/2510.27529},
  note = {Source identifier: 2510.27529}
}