@misc{indiciae4b270f8bf0fa,
  title = {A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures},
  author = {Yanpeng Gong and Sishuai Li and Yue Mei and Bingbing Xu and Fei Qin and Xiaoying Zhuang and Timon Rabczuk},
  year = {2025},
  doi = {10.1016/j.enganabound.2026.106640},
  url = {https://arxiv.org/abs/2511.09348},
  note = {Source identifier: 2511.09348}
}