TY  - RPRT
TI  - A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures
AU  - Yanpeng Gong
AU  - Sishuai Li
AU  - Yue Mei
AU  - Bingbing Xu
AU  - Fei Qin
AU  - Xiaoying Zhuang
AU  - Timon Rabczuk
PY  - 2025
DO  - 10.1016/j.enganabound.2026.106640
UR  - https://arxiv.org/abs/2511.09348
ID  - 2511.09348
ER  -