@misc{indiciae4054dd97ed84,
  title = {ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC},
  author = {Qipan Wang and Tianxiang Zhu and Tianyu Jia and Yibo Lin and Runsheng Wang and Ru Huang},
  year = {2025},
  url = {https://arxiv.org/abs/2511.17319},
  note = {Source identifier: 2511.17319}
}