@misc{indiciae3cd36278668b,
  title = {Thermal conductance across bonded SiOx-SiOx interfaces in hybrid bonding process},
  author = {Xingqiang Zhang and Liu Chang and Liyi Li and Zhe Cheng},
  year = {2026},
  url = {https://arxiv.org/abs/2601.03106},
  note = {Source identifier: 2601.03106}
}