TY  - RPRT
TI  - Thermal conductance across bonded SiOx-SiOx interfaces in hybrid bonding process
AU  - Xingqiang Zhang
AU  - Liu Chang
AU  - Liyi Li
AU  - Zhe Cheng
PY  - 2026
UR  - https://arxiv.org/abs/2601.03106
ID  - 2601.03106
ER  -