TY  - RPRT
TI  - ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity
AU  - Qipan Wang
AU  - Tianxiang Zhu
AU  - Yibo Lin
AU  - Runsheng Wang
AU  - Ru Huang
PY  - 2026
DO  - 10.1109/iseda62518.2024.10617604
UR  - https://arxiv.org/abs/2601.11050
ID  - 2601.11050
ER  -