@misc{indiciae6ea64b5f13bb,
  title = {A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks},
  author = {Max Bloomfield and Amogh Wasti and Zongmin Yang and Matthew Galarza and Theodorian Borca-Tasciuc and Jacob Merson and Timothy Chainer and Prabudhya Roy Chowdhury and Aakrati Jain},
  year = {2026},
  doi = {10.1109/itherm55376.2025.11235683},
  url = {https://arxiv.org/abs/2602.06999},
  note = {Source identifier: 2602.06999}
}