@misc{indiciaedf8955ade306,
  title = {Tuning Cu/Diamond Interfacial Thermal Conductance via Nitrogen-Termination Engineering},
  author = {Guang Yang and Xinling Tang and Zhongkang Lin and Yulin Gu and Wei Hao and Yujie Du and Xiaoguang Wei},
  year = {2026},
  url = {https://arxiv.org/abs/2603.16347},
  note = {Source identifier: 2603.16347}
}