@misc{indiciae0237b72a922b,
  title = {Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack},
  author = {Mohammad Elahi and Max O. Bloomfield and Theodorian Borca-Tasciuc and Jacob S. Merson},
  year = {2026},
  url = {https://arxiv.org/abs/2605.00399},
  note = {Source identifier: 2605.00399}
}