@misc{indiciae6239c54b748a,
  title = {Bending-like stress induced by solder joint under uniaxial tensile testing in 2G-HTS tapes: Impact and optimization approach},
  author = {Dean Liu and Yue Wu and Haoliang Xiang and Xiaofen Li and Caida Fu and Chiheng Dong and Yue Zhao},
  year = {2026},
  url = {https://arxiv.org/abs/2605.30760},
  note = {Source identifier: 2605.30760}
}