TY  - RPRT
TI  - Bending-like stress induced by solder joint under uniaxial tensile testing in 2G-HTS tapes: Impact and optimization approach
AU  - Dean Liu
AU  - Yue Wu
AU  - Haoliang Xiang
AU  - Xiaofen Li
AU  - Caida Fu
AU  - Chiheng Dong
AU  - Yue Zhao
PY  - 2026
UR  - https://arxiv.org/abs/2605.30760
ID  - 2605.30760
ER  -