@misc{indiciae2c3a7080abb8,
  title = {Interface-engineered oxidation-resistant wafer-level Tantalum-Tantalum thermocompression bonding for 3D integration of superconducting interconnects},
  author = {Harsh Mishra and Ullas Pandey and Sathish Bonam and Adirae Dinesh and Sai Rama Krishna Malladi and Shiv Govind Singh},
  year = {2026},
  url = {https://arxiv.org/abs/2606.14103},
  note = {Source identifier: 2606.14103}
}