TY  - RPRT
TI  - Interface-engineered oxidation-resistant wafer-level Tantalum-Tantalum thermocompression bonding for 3D integration of superconducting interconnects
AU  - Harsh Mishra
AU  - Ullas Pandey
AU  - Sathish Bonam
AU  - Adirae Dinesh
AU  - Sai Rama Krishna Malladi
AU  - Shiv Govind Singh
PY  - 2026
UR  - https://arxiv.org/abs/2606.14103
ID  - 2606.14103
ER  -