@misc{indiciae2facfca9e04d,
  title = {Multi-channel high-speed flip-chip packaging platform for thin-film lithium niobate photonic circuits},
  author = {Zhenzheng Wang and Xiangzhi Xie and Yikun Chen and Yifan Wu and Zeyu Luo and Hanke Feng and Yulong Chen and Zengyi Xu and Zixi Wang and Yuansong Zeng and Mandie Huang and Ke Zhang and Yingxia Liu and Cheng Wang},
  year = {2026},
  url = {https://arxiv.org/abs/2606.15391},
  note = {Source identifier: 2606.15391}
}