@misc{indiciae5a57a936ec03,
  title = {WarpagePINN: Thermal Warpage Prediction in Advanced Packaging via a Two-Stage Physics-Informed Neural Networks},
  author = {Xinyu Li and Min Tang and Zeyu Sun and Wenxing Zhu and Jianhua Zhang and Liang Chen},
  year = {2026},
  url = {https://arxiv.org/abs/2607.00364},
  note = {Source identifier: 2607.00364}
}