TY  - RPRT
TI  - WarpagePINN: Thermal Warpage Prediction in Advanced Packaging via a Two-Stage Physics-Informed Neural Networks
AU  - Xinyu Li
AU  - Min Tang
AU  - Zeyu Sun
AU  - Wenxing Zhu
AU  - Jianhua Zhang
AU  - Liang Chen
PY  - 2026
UR  - https://arxiv.org/abs/2607.00364
ID  - 2607.00364
ER  -