@misc{indiciae328833a9d896,
  title = {Chiplet3D: Pin- and Thermal-Aware 3D Chiplet Floorplanning via Convolution-Embedded MILP},
  author = {Shuo Ren and Libo Shen and Yaohui Han and Rongliang Fu and Junying Huang and Bei Yu and Tsung-Yi Ho},
  year = {2026},
  url = {https://arxiv.org/abs/2607.09742},
  note = {Source identifier: 2607.09742}
}