@misc{indiciaec60d9ba1b0e4,
  title = {Flip-chip integrated superconducting qubits using electroplated bump bonds},
  author = {Yen-An Shih and Rebecca Gharibaan and Barka Khan and Dhananjay Joshi and Siddharth Singh and Martijn F. S. Zwanenburg and Eugene Y. Huang and Nataliia Zhurbina and Figen Yilmaz and Lukas Johannes Splitthoff and Srijit Goswami and Christian Kraglund Andersen},
  year = {2026},
  url = {https://arxiv.org/abs/2608.07306},
  note = {Source identifier: 2608.07306}
}