@misc{indiciae54dc55311cda,
  title = {Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements},
  author = {Zifeng Huang and Yiyang Sun and Tianyu Jia and Runsheng Wang and Zhe Cheng},
  year = {2026},
  url = {https://arxiv.org/abs/2609.20379},
  note = {Source identifier: 2609.20379}
}