@misc{indiciaed721b0bb4cc4,
  title = {A Cut Finite Element Method for Transient Thermal Simulation in Multi-material Electronic Packaging Structures},
  author = {Hao Dong},
  year = {2026},
  url = {https://arxiv.org/abs/2610.08543},
  note = {Source identifier: 2610.08543}
}