TY  - RPRT
TI  - A Low-Temperature Atomic Layer Deposition Liftoff Method for Microelectronic and Nanoelectronic Applications
AU  - M. J. Biercuk
AU  - D. J. Monsma
AU  - C. M. Marcus
AU  - J. S. Becker
AU  - R. G. Gordon
PY  - 2003
DO  - 10.1063/1.1612904
UR  - https://arxiv.org/abs/cond-mat/0305711
ID  - cond-mat/0305711
ER  -