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At least 199 records · Page 11Linked to original sources

arXiv2008

Some properties of the regular asynchronous systems

The asynchronous systems are the models of the asynchronous circuits from the digital electrical engineering. An asynchronous system f is a multi-valued function that assigns to each admissible input u a set f(u) of possible states x in f(u). A special case of asynchronous system consists in the existence of a Boolean function Υsuch that for any u and any x in f(u), a certain equation involving Υis fulfilled. Then Υis called the generator function of f (Moisil used the terminology of network function) and we say that f is generated by Υ. The systems that have a generator function are called regular. Our purpose is to continue the study of the generation of the asynchronous systems that was started in [2], [3].

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arXiv2008

From a set of parts to an indivisible whole. Part II: Operations in an open comparative mode

This paper describes a new method, HGV2C, for pattern analysis. The HGV2C method involves the construction of a computer ego (CE) based on an individual object that can be either a part of the system under analysis or a newly created object based on a certain hypothesis. The CE provides a capability to analyze data from a specific standpoint, e.g. from a viewpoint of a certain object. The CE is constructed from two identical copies of a query object, and its functioning mechanism involves: a hypothesis-parameter (HP) and infothyristor (IT). HP is a parameter that is introduced into an existing set of parameters. The HP value for one of the clones of a query object is set to equal 1, whereas for another clone it is greater than 1. The IT is based on the previously described algorithm of iterative averaging and performs three functions: 1) computation of a similarity matrix for the group of three objects including two clones of a query object and a target object; 2) division of the group into two alternative subgroups; and 3) a successive increase of the HP weight in the totality of all the parameters. Initially, both clones of the query object appear together in one of the subgroups as all of their parameter values, except the HP, are identical. At a certain point of the HP multiplication, one of the clones moves to the group of the target object. A respective number of the HP multiplications represents the dissimilarity (D) between the query and target objects. The product of D multiplied by the difference in HP values of the clones is strictly constant and linearly increases as the difference in HP values of the clones decreases. This new approach to knowledge representation is demonstrated on the example of population pyramids of 220 countries.

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arXiv2008

Climate modification directed by control theory

Climate modification measures to counteract global warming receive some more new attentions in these years. Most current researches only discuss the impact of these measures to climate, but how to design such a climate regulator is still unknown. This paper shows the control theory could give the systematic direction for climate modification. But the control analyzing also reveals that climate modifications should only be regarded as a last-ditch measure.

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arXiv2008

Sub-$μ$ structured Lotus Surfaces Manufacturing

Sub-micro structured surfaces allow modifying the behavior of polymer films or components. Especially in micro fluidics a lotus-like characteristic is requested for many applications. Structure details with a high aspect ratio are necessary to decouple the bottom and the top of the functional layer. Unlike to stochastic methods, patterning with a LIGA-mold insert it is possible to structure surfaces very uniformly or even with controlled variations (e.g. with gradients). In this paper we present the process chain to realize polymer sub-micro structures with minimum lateral feature size of 400 nm and up to 4 micrometers high.

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arXiv2008

Linear and Non Linear Behaviour of Mechanical Resonators for Optimized Inertial Electromagnetic Microgenerators

The need for wearable or abandoned microsystems, as well as the trend to a lower power consumption of electronic devices, make miniaturized renewable energy generators a viable alternative to batteries. Among the different alternatives, an interesting option is the use of inertial microgenerators for energy scavenging from vibrations present in the environment. These devices constitute perpetual energy sources without the need for refilling, thus being well suited for abandoned sensors, wireless systems or microsystems which must be embedded within the structure, without outside physical connections. Different electromagnetic energy scavenging devices have been described in the literature [1,2,3], based on the use of a velocity damped resonator, which is well suited for harvesting of vibrational energy induced by the operation of machines. These vibrations are characterized by a well defined frequency (in the range between few Hz's and few kHz's) and low displacement amplitudes. Adjusting the resonant frequency of the system to that of the vibrations allows amplification of these low amplitude displacements. Moreover, for these applications, the use of an electromagnetic device has the potential advantages of a good level of compatibility with Si Microsystem technology, as well as the possibility of relatively high electromechanical coupling with simple designs.

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arXiv2008

Design And Fabrication of Condenser Microphone Using Wafer Transfer And Micro-electroplating Technique

A novel fabrication process, which uses wafer transfer and micro-electroplating technique, has been proposed and tested. In this paper, the effects of the diaphragm thickness and stress, the air-gap thickness, and the area ratio of acoustic holes to backplate on the sensitivity of the condenser microphone have been demonstrated since the performance of the microphone depends on these parameters. The microphone diaphragm has been designed with a diameter and thickness of 1.9 mm and 0.6 $μ$m, respectively, an air-gap thickness of 10 $μ$m, and a 24% area ratio of acoustic holes to backplate. To obtain a lower initial stress, the material used for the diaphragm is polyimide. The measured sensitivities of the microphone at the bias voltages of 24 V and 12 V are -45.3 and -50.2 dB/Pa (at 1 kHz), respectively. The fabricated microphone shows a flat frequency response extending to 20 kHz.

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arXiv2008

Porous Alumina Based Capacitive MEMS RH Sensor

The aim of a joint research and development project at the BME and HWU is to produce a cheap, reliable, low-power and CMOS-MEMS process compatible capacitive type relative humidity (RH) sensor that can be incorporated into a state-of-the-art, wireless sensor network. In this paper we discuss the preparation of our new capacitive structure based on post-CMOS MEMS processes and the methods which were used to characterize the thin film porous alumina sensing layer. The average sensitivity is approx. 15 pF/RH% which is more than a magnitude higher than the values found in the literature. The sensor is equipped with integrated resistive heating, which can be used for maintenance to reduce drift, or for keeping the sensing layer at elevated temperature, as an alternative method for temperature-dependence cancellation.

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arXiv2008

Integrated RF MEMS/CMOS Devices

A maskless post-processing technique for CMOS chips is developed that enables the fabrication of RF MEMS parallel-plate capacitors with a high quality factor and a very compact size. Simulations and measured results are presented for several MEMS/CMOS capacitors. A 2-pole coupled line tunable bandpass filter with a center frequency of 9.5 GHz is designed, fabricated and tested. A tuning range of 17% is achieved using integrated variable MEMS/CMOS capacitors with a quality factor exceeding 20. The tunable filter occupies a chip area of 1.2 x 2.1 mm2.

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arXiv2008

Design Methodology and Manufacture of a Microinductor

Potential core materials to supersede ferrite in the 0.5-10 MHz frequency range are investigated. The performance of electrodeposited nickel-iron, cobalt-iron-copper alloys and the commercial alloy Vitrovac 6025 have been assessed through their inclusion within a custom-made solenoid microinductor. Although the present inductor, at 500 KHz, achieves 77% power efficiency for 24.7W/cm3 power density, an optimized process predicts a power efficiency of 97% for 30.83W/cm3 power density. The principle issues regarding microinductor design and performance are discussed.

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arXiv2008

Megasonic Enhanced Electrodeposition

A novel way of filling high aspect ratio vertical interconnection (microvias) with an aspect ratio of >2:1 is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are possible for the manufacturing of interconnections and metal-based MEMS.

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arXiv2008

UV Direct-Writing of Metals on Polyimide

Conductive micro-patterned copper tracks were fabricated by UV direct-writing of a nanoparticle silver seed layer followed by selective electroless copper deposition. Silver ions were first incorporated into a hydrolyzed polyimide surface layer by wet chemical treatment. A photoreactive polymer coating, methoxy poly(ethylene glycol) (MPEG) was coated on top of the substrate prior to UV irradiation. Electrons released through the interaction between the MPEG molecules and UV photons allowed the reduction of the silver ions across the MPEG/doped polyimide interface. The resultant silver seed layer has a cluster morphology which is suitable for the initiation of electroless plating. Initial results showed that the deposited copper tracks were in good agreement with the track width on the photomask and laser direct-writing can also fabricate smaller line width metal tracks with good accuracy. The facile fabrication presented here can be carried out in air, at atmospheric pressure, and on contoured surfaces.

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arXiv2008

Micro Embossing of Ceramic Green Substrates for Micro Devices

Multilayered ceramic substrates with embedded micro patterns are becoming increasingly important, for example, in harsh environment electronics and microfluidic devices. Fabrication of these embedded micro patterns, such as micro channels, cavities and vias, is a challenge. This study focuses on the process of patterning micro features on ceramic green substrates using micro embossing. A ceramic green tape that possessed near-zero shrinkage in the x-y plane was used, six layers of which were laminated as the embossing substrate. The process parameters that impact on the pattern fidelity were investigated and optimized in this study. Micro features with line-width as small as several micrometers were formed on the ceramic green substrates. The dynamic thermo-mechanical analysis indicated that extending the holding time at certain temperature range would harden the green substrates with little effect on improving the embossing fidelity. Ceramic substrates with embossed micro patterns were obtain d after co-firing. The embedded micro channels were also obtained by laminating the green tapes on the embossed substrates.

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arXiv2008

Characterization and Modeling of an Electro-thermal MEMS Structure

Thermal functional circuits are an interesting and perspectivic group of the MEMS elements. A practical realization is called Quadratic Transfer Characteristic (QTC) element which driving principle is the Seebeck-effect. In this paper we present the analyses of a QTC element from different perspectives. To check the real behavior of the device, we measured a few, secondary properties of the structure which correspond to special behavior because these properties can not be easily derived from the main characteristics.

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arXiv2008

Measurement of Large Forces and Deflections in Microstructures

Properties of typical MEMS materials have been widely investigated. Mechanical properties of MEMS structures depend not only on the bulk material properties, but also structural factors. A measurement system has been made to measure force/deflection on microstructures to examine some of the structural properties. This is a stylus setup integrated with a load cell and a linear actuator. First, the requirements for the measurement system were established. Then the system was built up and characterized. We have successfully made measurements on a typical micromechanical structure, a cantilever accelerometer design. The stylus placement accuracy, the spring constant along the proof mass, analysis of the force/deflection curve shape and destructive tests on the cantilever have been investigated in our experiment and will be presented in this paper.

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arXiv2008

Contactless Thermal Characterization of High Temperature Test Chamber

In this paper the methodology and the results of a contactless thermal characterization of a high temperature test chamber will be introduced. The test chamber is used for fatigue testing of different MEMS devices where the homogenous temperature distribution within the close proximity from the heating filaments is very important. Our aim was to characterize the evolving temperature distribution inside the test chamber. In order to achieve smaller time constant a new contactless sensor card was developed. The contactless thermal characterization method introduced in this paper enables in situ heat distribution measurement inside the test chamber during operation, with the detection of potentially uneven heat distribution.

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arXiv2008

Processing and Characterization of Precision Microparts from Nickel-based Materials

The objective of this research was to study the influence of electroplating parameters on electrodeposit characteristics for the production of nickel (Ni) and nickel-iron (Ni-Fe) microparts by photoelectroforming. The research focused on the most relevant parameter for industry, which is the current density, because it determines the process time and the consumed energy. The results of the Ni and Ni-Fe characterisations can be divided into two aspects closely linked with each other ; the morphology and the hardness.

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arXiv2008

Manufacturing of A micro probe using supersonic aided electrolysis process

In this paper, a practical micromachining technology was applied for the fabrication of a micro probe using a complex nontraditional machining process. A series process was combined to machine tungsten carbide rods from original dimension. The original dimension of tungsten carbide rods was 3mm ; the rods were ground to a fixed-dimension of 50 micrometers using precision grinding machine in first step. And then, the rod could be machined to a middle-dimension of 20 micrometers by electrolysis. A final desired micro dimension can be achieved using supersonic aided electrolysis. High-aspect-ratio of micro tungsten carbide rod was easily obtained by this process. Surface roughness of the sample with supersonic aided agitation was compared with that with no agitation in electrolysis. The machined surface of the sample is very smooth due to ionized particles of anode could be removed by supersonic aided agitation during electrolysis. Deep micro holes can also be achieved by the machined high-aspect-rati tungsten carbide rod using EDM process. A micro probe of a ball shape at the end was processed by proposed supersonic aided electrolysis machining process.

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arXiv2008

Large Area Roller Embossing of Multilayered Ceramic Green Composites

In this paper, we will report our achievements in developing large area patterning of multilayered ceramic green composites using roller embossing. The aim of our research is to pattern large area ceramic green composites using a modified roller laminating apparatus, which is compatible with screen printing machines, for integration of embossing and screen printing. The instrumentation of our roller embossing apparatus, as shown in Figure1, consists of roller 1 and rollers 2. Roller 1 is heated up to the desired embossing temperature ; roller 2 is, however, kept at room temperature. The mould is a nickel template manufactured by plating nickel-based micro patterns (height : 50 $μ$m) on a nickel film (thickness : 70 $μ$m) ; the substrate for the roller embossing is a multilayered Heraeus Heralock HL 2000 ceramic green composite. Comparing with the conventional simultaneous embossing, the advantages of roller embossing include : (1) low embossing force ; (2) easiness of demoulding ; (3) localized area in contact with heater ; and etc. We have demonstrated the capability of large area roller embossing with a panel size of 150mmx 150mm on the mentioned substrate. We have explored and confirmed the impact of parameters (feed speed, temperature of roller and applied pressure) to the pattern quality of roller embossing. Furthermore, under the optimized process parameters, we characterized the variations of pattern dimension over the panel area, and calculated a scaling factor in order to make the panel compatible with other processes. Figure 2 shows the embossed patterns on a 150mmx 150mm green ceramic panel.

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