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arXiv · 1111.4602

A chip-scale integrated cavity-electro-optomechanics platform

Martin Winger·Tim Blasius·Thiago P. Mayer Alegre·Amir H. Safavi-Naeini·Seán Meenehan·Justin Cohen·Søren Stobbe·Oskar Painter
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Abstract

We present an integrated optomechanical and electromechanical nanocavity, in which a common mechanical degree of freedom is coupled to an ultrahigh-Q photonic crystal defect cavity and an electrical circuit. The sys- tem allows for wide-range, fast electrical tuning of the optical nanocavity resonances, and for electrical control of optical radiation pressure back-action effects such as mechanical amplification (phonon lasing), cooling, and stiffening. These sort of integrated devices offer a new means to efficiently interconvert weak microwave and optical signals, and are expected to pave the way for a new class of micro-sensors utilizing optomechanical back-action for thermal noise reduction and low-noise optical read-out.

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Martin Winger, Tim Blasius, Thiago P. Mayer Alegre, Amir H. Safavi-Naeini, Seán Meenehan, Justin Cohen, Søren Stobbe, Oskar Painter. 2011-11-20. A chip-scale integrated cavity-electro-optomechanics platform. https://doi.org/10.1364/oe.19.024905

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