arXiv · 1205.2745
Modeling of Deformation and Texture Development of Copper in a 120° ECAE Die
Abstract
A flow line function is proposed to describe the material deformation in ECAE for a 120\degree die. This new analytical approach is incorporated into a viscoplastic self-consistent polycrystal code to simulate the texture evolution in Route A of copper and compared to experimental textures as well as to those corresponding to simple shear.
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Roxane Arruffat Massion, L. S. Toth, Jean-Philippe Mathieu. 2012-05-12. Modeling of Deformation and Texture Development of Copper in a 120° ECAE Die. https://doi.org/10.1016/j.scriptamat.2006.01.004
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