Modeling of Deformation and Texture Development of Copper in a 120° ECAE Die
A flow line function is proposed to describe the material deformation in ECAE for a 120\degree die. This new analytical approach is incorporated into a viscoplastic self-consistent polycrystal code to simulate the texture evolution in Route A of copper and compared to experimental textures as well as to those corresponding to simple shear.
cond-mat.mtrl-sci↗