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arXiv · 1402.2435

E-BLOW: E-Beam Lithography Overlapping aware Stencil Planning for MCC System

Bei Yu·Kun Yuan·Jhih-Rong Gao·David Z. Pan
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Abstract

Electron beam lithography (EBL) is a promising maskless solution for the technology beyond 14nm logic node. To overcome its throughput limitation, recently the traditional EBL system is extended into MCC system. %to further improve the throughput. In this paper, we present E-BLOW, a tool to solve the overlapping aware stencil planning (OSP) problems in MCC system. E-BLOW is integrated with several novel speedup techniques, i.e., successive relaxation, dynamic programming and KD-Tree based clustering, to achieve a good performance in terms of runtime and solution quality. Experimental results show that, compared with previous works, E-BLOW demonstrates better performance for both conventional EBL system and MCC system.

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Bei Yu, Kun Yuan, Jhih-Rong Gao, David Z. Pan. 2014-02-11. E-BLOW: E-Beam Lithography Overlapping aware Stencil Planning for MCC System. https://arxiv.org/abs/1402.2435

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