Estimation of the electrical and thermal contact resistances and thermoemf of thermoelectric material-metal transient contact layer due to semiconductor surface rougness

P. V. Gorskyi

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arXiv · 1809.02504

Estimation of the electrical and thermal contact resistances and thermoemf of thermoelectric material-metal transient contact layer due to semiconductor surface rougness

P. V. Gorskyi

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Abstract

The impact of semiconductor surface roughness on the electrical and thermal contact resistances and thermoEMF of thermoelectric material (TEM)-metal transient contact layer is studied theoretically. The distribution of hollows and humps on the rough surface is simulated by the truncated Gaussian distribution. The impact of distribution parameters on the electrical contact resistance and thermoEMF of thermoelectric material-metal contact is studied.

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P. V. Gorskyi. 2018-09-06. Estimation of the electrical and thermal contact resistances and thermoemf of thermoelectric material-metal transient contact layer due to semiconductor surface rougness. https://arxiv.org/abs/1809.02504

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