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arXiv · 1903.10848

Crossover between electron-phonon and boundary resistance limited thermal relaxation in copper films

L. B. Wang·O. -P. Saira·D. S. Golubev·J. P. Pekola
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Abstract

We observe a crossover from electron-phonon (ep) coupling limited energy relaxation to that governed by thermal boundary resistance (pp) in copper films at sub-kelvin temperatures. Our measurement yields a quantitative picture of heat currents, in terms of temperature dependences and magnitudes, in both ep and pp limited regimes, respectively. We show that by adding a third layer in between the copper film and the substrate, the thermal boundary resistance is increased fourfold, consistent with an assumed series connection of thermal resistances.

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L. B. Wang, O. -P. Saira, D. S. Golubev, J. P. Pekola. 2019-03-26. Crossover between electron-phonon and boundary resistance limited thermal relaxation in copper films. https://doi.org/10.1103/physrevapplied.12.024051

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