arXiv · 1907.02481
Thick adherent diamond films on AlN with low thermal barrier resistance
Abstract
Growth of $>$100 $\mu$m thick diamond layer adherent on aluminium nitride is presented in this work. While thick films failed to adhere on untreated AlN films, hydrogen/nitrogen plasma treated AlN films retained the thick diamond layers. Clear differences in zeta potential measurement confirms the surface modification due to hydrogen/nitrogen plasma treatment. Areal Raman maps showed an increase in non-diamond carbon in the initial layers of diamond grown on pre-treated AlN. The presence of non-diamond carbon has minimal effect on the interface between diamond and AlN. The surfaces studied with x-ray photoelectron spectroscopy (XPS) revealed a clear distinction between pre-treated and untreated samples. The surface aluminium goes from nitrogen rich environment to an oxygen rich environment after pre-treatment. Cross section transmission electron microscopy shows a clean interface between diamond and AlN. Thermal barrier resistance between diamond and AlN was found to be in the range of 16 m$^2$K/GW which is a large improvement on the current state-of-the-art.
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Soumen Mandal, Jerome Cuenca, Fabien Massabuau, Chao Yuan, Henry Bland, James W. Pomeroy, David Wallis, Tim Batten, David Morgan, Rachel Oliver, Martin Kuball, Oliver A. Williams. 2019-07-04. Thick adherent diamond films on AlN with low thermal barrier resistance. https://arxiv.org/abs/1907.02481
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