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arXiv · 2102.13293

Entanglement Across Separate Silicon Dies in a Modular Superconducting Qubit Device

Alysson Gold·JP Paquette·Anna Stockklauser·Matthew J. Reagor·M. Sohaib Alam·Andrew Bestwick·Nicolas Didier·Ani Nersisyan·Feyza Oruc·Armin Razavi·Ben Scharmann·Eyob A. Sete·Biswajit Sur·Davide Venturelli·Cody James Winkleblack·Filip Wudarski·Mike Harburn·Chad Rigetti
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Abstract

Assembling future large-scale quantum computers out of smaller, specialized modules promises to simplify a number of formidable science and engineering challenges. One of the primary challenges in developing a modular architecture is in engineering high fidelity, low-latency quantum interconnects between modules. Here we demonstrate a modular solid state architecture with deterministic inter-module coupling between four physically separate, interchangeable superconducting qubit integrated circuits, achieving two-qubit gate fidelities as high as 99.1$\pm0.5$\% and 98.3$\pm$0.3\% for iSWAP and CZ entangling gates, respectively. The quality of the inter-module entanglement is further confirmed by a demonstration of Bell-inequality violation for disjoint pairs of entangled qubits across the four separate silicon dies. Having proven out the fundamental building blocks, this work provides the technological foundations for a modular quantum processor: technology which will accelerate near-term experimental efforts and open up new paths to the fault-tolerant era for solid state qubit architectures.

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Alysson Gold, JP Paquette, Anna Stockklauser, Matthew J. Reagor, M. Sohaib Alam, Andrew Bestwick, Nicolas Didier, Ani Nersisyan, Feyza Oruc, Armin Razavi, Ben Scharmann, Eyob A. Sete, Biswajit Sur, Davide Venturelli, Cody James Winkleblack, Filip Wudarski, Mike Harburn, Chad Rigetti. 2021-02-26. Entanglement Across Separate Silicon Dies in a Modular Superconducting Qubit Device. https://arxiv.org/abs/2102.13293

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