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arXiv · 2201.01847

Non-destructive mapping of stress, strain and stiffness of thin elastically deformed materials

Guo-Yang Li·Artur L. Gower·Michel Destrade·Seok-Hyun Yun
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Abstract

Knowing the stress within a soft material is of fundamental interest to basic research and practical applications, such as soft matter devices, biomaterial engineering, and medical sciences. However, it is challenging to measure stress fields in situ in a non-invasive way. It becomes even more difficult if the mechanical properties of the material are unknown or altered by the stress. Here we present a robust non-destructive technique capable of measuring in situ stress and strain in elastically deformed thin films without the need to know their material properties. The technique is based on measuring elastic wave speeds, and then using a universal dispersion curve we derived for Lamb wave to predict the local stress and strain. Using optical coherence tomography, we experimentally verified the method for a rubber sheet, a cling film, and the leather skin of a musical instrument.

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Guo-Yang Li, Artur L. Gower, Michel Destrade, Seok-Hyun Yun. 2022-01-05. Non-destructive mapping of stress, strain and stiffness of thin elastically deformed materials. https://arxiv.org/abs/2201.01847

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