{\alpha}-Ta (111) Thin Films for Qubit Applications: A Study of Thickness Dependence and Universal Scaling

Abstract

We explore the growth of {\alpha}-Ta thin films ranging from ultra-thin (2 nm) to thick (250 nm) films grown by sputter epitaxy on c-plane sapphire substrates. We utilized 100 W power with a 32 mTorr sputter pressure at 650 {\deg} substrate deposition temperature. We used X-ray diffractometry to extract the lattice constant and growth orientation of the films, finding a mono-oriented (111) films with a lattice spacing in agreement with a bulk Ta value of 3.31 {\AA}. X-ray reflectometry is used to characterize the native oxide, film, and substrate-film interface as a function of thickness. We observe a very smooth morphology with an average roughness of 700 pm, as determined by both reflectometry and atomic force microscopy. The film nucleates with small islands, whose terrace width grows linearly as a function of thickness until 150 nm, where the terrace width becomes constant. From our reflectometry measurements, we uncover a pseudomorphic layer with a critical thickness of 1 nm and a self-limiting amorphous oxide that grows to a thickness of 2.25 nm; both of these layers are independent of thickness beyond 4 nm total thickness. We also studied the superconducting transition through electronic transport measurements using the Van der Pauw method to measure resistivity as a function of temperature. We observed a smooth evolution in critical superconducting temperature with total film thickness, from 2.9 {\deg}K for 7.5 nm to 4.2 {\deg}K for 269.2 nm, as expected from universal thickness scaling in superconductors. Density functional theory simulations were used to understand the oxidation process at the top surface layers of {\alpha}-Ta (111). We observed that as the oxygen content on the surface increases, the Ta progressively loses its crystalline structure. Significant structural distortions occur when the Ta:O ratio exceeds 1:1, forming an amorphous TaO phase.