Package-Embedded Coupled Inductor Arrays for High-Performance Computing Power Delivery

Abstract

A novel power delivery framework, comprising a package-embedded inductor topology and an inductance-island methodology, is introduced to maximize both inductance and current densities in vertical power delivery (VPD). The framework leverages multiple multi-phase converters, a common strategy in high-performance computing systems, to enhance efficiency and scalability. The proposed topology employs an array of tightly coupled spiral square inductors sharing a common magnetic rod, serving multiple converters operating in the same conversion phase. The array is optimized to maximize coupling and minimize conversion losses, achieving superior inductance and current densities of 250 nH/mm^2 and 10 A/mm^2, respectively. At the system level, the inductance-island methodology partitions the power delivery network into multiple islands, each dedicated to a converter phase and supplying a portion of the load current, thereby enabling scalable and efficient distribution. To validate the framework, the inductor array is designed and simulated in ANSYS Maxwell 3D and Mechanical, exhibiting an average quality factor of 23.6 and efficiency of 97.4% at 2 A load current, 6 V input, and 10 MHz switching frequency. The inductor array netlist is extracted from ANSYS and co-designed in Cadence Virtuoso with a distributed dual-phase power conversion system, ensuring joint optimization of passive and active components. The co-designed converter achieves a significant efficiency gain of 5.65% on average and up to 11.04% at 40 A load over a similar converter with uncoupled inductors, demonstrating the practical benefits of the approach.