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Application of Raman Scattering to Study the Strain Distribution in SiGe Layers

Zhongwei Pan·Richard Chin
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Abstract

In this paper, we mainly present a new simple, efficient and nondestructive Raman scattering analysis method to study the distribution of strain in SiGe alloy films. The method can simultaneously determine both Ge fractional composition x and strain of SiGe films. We use the Ar+ laser lines (514.5, 488 and 457.9 nm) to detect the information of different depth of SiGe layers. The results show that the x value (about 0.50) of Si1-xGex and the strain of the films decrease from the interface between SiGe layers and Si substrates to SiGe surface.

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Zhongwei Pan, Richard Chin. 1999-06-17. Application of Raman Scattering to Study the Strain Distribution in SiGe Layers. https://arxiv.org/abs/cond-mat/9905175

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