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A thermostable trilayer resist for niobium lift-off

P. Dubos·P. Charlat·Th. Crozes·P. Paniez·B. Pannetier
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Abstract

We have developped a novel lift-off process for fabrication of high quality superconducting submicron niobium structures. The process makes use of a thermostable polymer with a high transition temperature T_{g}= 235 C and an excellent chemical stability. The superconducting critical temperature of 100 nm wide niobium lines is above 7 K. An example of shadow evaporation of a Nb-Cu submicron hybrid structure is given. A potential application of this process is the fabrication of very small single electron devices using refratory metals.

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P. Dubos, P. Charlat, Th. Crozes, P. Paniez, B. Pannetier. 1999-09-03. A thermostable trilayer resist for niobium lift-off. https://doi.org/10.1116/1.591162

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